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Tokyo Oka TCA-2500 Asher
Overview
The Tokyo Oka TCA-2500 Asher is a semiconductor plasma ashing system designed for efficient photoresist stripping, residue removal, and wafer surface cleaning during semiconductor manufacturing. The system is suitable for semiconductor fabrication, MEMS production, microelectronics process development, and advanced research laboratories requiring reliable and repeatable plasma cleaning processes.
The TCA-2500 utilizes plasma ashing technology to remove organic materials and photoresist following lithography and etching processes while maintaining excellent process uniformity and minimizing substrate damage.
Key Features
- Manufacturer: TOK (Tokyo Ohka Kogyo)
- Model: TCA-2500
- Equipment Type: Asher
- Category: Asher
- Condition: Used Semiconductor Equipment
Typical Applications
- Photoresist stripping
- Plasma cleaning
- Organic residue removal
- Wafer surface preparation
- Semiconductor process development
- MEMS fabrication
- Microelectronics manufacturing
- University cleanroom laboratories
- Pilot semiconductor fabrication facilities
Technology Advantages
- Efficient plasma-based photoresist removal
- Uniform wafer cleaning performance
- Excellent process repeatability
- Low substrate damage
- Suitable for research and pilot-scale manufacturing
- Flexible process development capabilities
Equipment Information
| Parameter | Specification |
|---|---|
| Manufacturer | TOK (Tokyo Ohka Kogyo) |
| Model | TCA-2500 |
| Category | Asher |
| Process Type | Plasma Asher |
| Equipment Condition | Used |
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Important Notice
Product image is provided for marketing and illustrative purposes only. The image shown may not represent the exact equipment available from the supplier. Actual equipment may vary in appearance, configuration, manufacturing year, installed options, accessories, specifications, and condition.
South Asia Semiconductor (SAS) provides semiconductor equipment sourcing and procurement services through trusted international suppliers. SAS does not claim ownership of the equipment unless explicitly stated. Equipment specifications, availability, pricing, condition, and final configuration are subject to confirmation by the supplier at the time of inquiry. Photographs and detailed specifications of the actual available equipment can be provided to qualified buyers upon request.
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