Applied Materials CMP 5201 Chemical Mechanical Planarization (CMP) System

Applied Materials CMP 5201 Chemical Mechanical Planarization (CMP) System

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Applied Materials CMP 5201 Chemical Mechanical Planarization (CMP) System

Applied Materials CMP 5201 Chemical Mechanical Planarization (CMP) System


Overview

The Applied Materials CMP 5201 is a Chemical Mechanical Planarization (CMP) system designed for precision wafer planarization in semiconductor manufacturing. Commonly associated with the Mirra 3400 platform, this system is used to achieve highly uniform wafer surfaces during integrated circuit fabrication, improving layer flatness and enabling advanced semiconductor processing.

The CMP 5201 is suitable for semiconductor fabrication facilities, MEMS manufacturing, process development, and research laboratories requiring reliable wafer polishing and planarization capabilities.


Key Features

  • Manufacturer: Applied Materials (AMAT)
  • Model: CMP 5201
  • Platform: Mirra 3400
  • Automation: AS 2000
  • Equipment Type: Chemical Mechanical Planarization (CMP) System
  • Category: Wafer Grinding, Lapping & Polishing
  • Condition: Used Semiconductor Equipment
  • Year of Manufacture: 2000

Typical Applications

  • Chemical Mechanical Planarization (CMP)
  • Wafer surface planarization
  • Integrated circuit manufacturing
  • Semiconductor process development
  • MEMS fabrication
  • Interlayer dielectric polishing
  • Copper and tungsten planarization
  • University cleanroom laboratories
  • Pilot semiconductor fabrication facilities

Technology Advantages

  • High-precision wafer planarization
  • Excellent surface uniformity
  • Consistent polishing performance
  • Reliable process repeatability
  • Suitable for research and pilot-scale manufacturing
  • Proven semiconductor production platform

Equipment Information

ParameterSpecification
ManufacturerApplied Materials (AMAT)
ModelCMP 5201
PlatformMirra 3400
AutomationAS 2000
Equipment TypeChemical Mechanical Planarization (CMP) System
CategoryWafer Grinding, Lapping & Polishing
Process TypeWafer Planarization / CMP
Year of Manufacture2000
Equipment ID9030286
Equipment ConditionUsed

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Important Notice

Product image is provided for marketing and illustrative purposes only. The image shown may not represent the exact equipment available from the supplier. Actual equipment may vary in appearance, configuration, manufacturing year, installed options, accessories, specifications, and condition.

South Asia Semiconductor (SAS) provides semiconductor equipment sourcing and procurement services through trusted international suppliers. SAS does not claim ownership of the equipment unless explicitly stated. Equipment specifications, availability, pricing, condition, lead time, and final configuration are subject to confirmation by the supplier at the time of inquiry. Photographs, inspection reports, and detailed specifications of the actual available equipment can be provided to qualified buyers upon request.

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