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ASML TWINSCAN AT1250 DUV Lithography System (193 nm)
Overview
The ASML TWINSCAN AT1250 is a 193 nm Deep Ultraviolet (DUV) lithography system designed for advanced semiconductor wafer patterning. Introduced for manufacturing around the 65 nm technology generation, it is suitable for semiconductor manufacturing, research institutions, and technology development projects requiring high-precision optical lithography.
Key Features
- Manufacturer: ASML
- Model: AT1250 (TWINSCAN)
- Lithography Type: 193 nm DUV
- Wafer Size: 200 mm
- Technology Generation: 65 nm-class production
- Year of Manufacture: 2003
- CE Marked
Typical Applications
- Semiconductor manufacturing
- Process development
- Research and development
- University cleanrooms
- Pilot fabrication facilities
General Specifications
| Parameter | Specification |
|---|---|
| Manufacturer | ASML |
| Model | AT1250 |
| Lithography Type | DUV 193 nm |
| Wafer Size | 200 mm |
| Year | 2003 |
| Condition | Used |
| CE Certification | Yes |
| Approximate Weight | 18 Ton |
| Approximate Height | 310 cm |
Equipment Status
Used semiconductor equipment. Actual operational condition, included accessories, and configuration should be confirmed during the quotation process.
Inquiry
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Important Notice
Product image is for illustration purposes only.
South Asia Semiconductor (SAS) provides semiconductor equipment sourcing services through international suppliers. Equipment availability, specifications, pricing, and condition are subject to confirmation by the supplier at the time of inquiry.
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